74VHC08CW
vs
74LVC27BQ
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
DIE,
|
2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AHC/VHC
|
LVC/LCX/Z
|
| JESD-30 Code |
R-XUUC-N14
|
R-PQCC-N14
|
| Logic IC Type |
AND GATE
|
NOR GATE
|
| Number of Functions |
4
|
3
|
| Number of Inputs |
2
|
3
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
HVQCCN
|
| Package Equivalence Code |
DIE OR CHIP
|
LCC14,.1X.12,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Propagation Delay (tpd) |
12.3 ns
|
13.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
QUAD
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
14
|
| JESD-609 Code |
|
e4
|
| Length |
|
3 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.024 A
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
5.9 ns
|
| Schmitt Trigger |
|
NO
|
| Seated Height-Max |
|
1 mm
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Pitch |
|
0.5 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
2.5 mm
|
|
|
|
Compare 74VHC08CW with alternatives
Compare 74LVC27BQ with alternatives