82S123BEA vs N82S123N feature comparison

82S123BEA QP Semiconductor

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N82S123N YAGEO Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC PHILIPS COMPONENTS
Package Description , DIP-16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 50 ns 50 ns
JESD-30 Code R-CDIP-T16 R-PDIP-T16
Memory Density 256 bit 256 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 32 words 32 words
Number of Words Code 32 32
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 32X8 32X8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 4

Compare 82S123BEA with alternatives

Compare N82S123N with alternatives