8403701CX vs CD54HC00F3A feature comparison

8403701CX Intersil Corporation

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CD54HC00F3A Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR INTERSIL CORP
Part Package Code DIP
Package Description DIP, DIP-14
Pin Count 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-CDIP-T14
Length 19.56 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level NOT APPLICABLE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT APPLICABLE
Propagation Delay (tpd) 135 ns 135 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT APPLICABLE
Width 7.62 mm
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Max I(ol) 0.00002 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Screening Level 38535Q/M;38534H;883B
Terminal Finish Tin/Lead (Sn/Pb)

Compare 8403701CX with alternatives

Compare CD54HC00F3A with alternatives