8602301EX vs MM54C200N feature comparison

8602301EX Philips Semiconductors

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MM54C200N Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP NATIONAL SEMICONDUCTOR CORP
Package Description , DIP,
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 120 ns 1200 ns
Memory Density 4096 bit 256 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 18 16
Number of Words 4096 words 256 words
Number of Words Code 4000 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 4KX1 256X1
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Supply Voltage-Max (Vsup) 5.5 V 15 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Position DUAL DUAL
Base Number Matches 5 2
JESD-30 Code R-XDIP-T16
Length 19.305 mm
Package Code DIP
Package Shape RECTANGULAR
Seated Height-Max 5.08 mm
Surface Mount NO
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Width 7.62 mm

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