933526230215
vs
BAS17,215
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
Package Description |
PLASTIC, SMD, 3 PIN
|
R-PDSO-G3
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.70
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
STABISTOR DIODE
|
STABISTOR DIODE
|
Forward Voltage-Max (VF) |
0.96 V
|
0.96 V
|
Forward Voltage-Min (VF) |
0.87 V
|
0.87 V
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Power Dissipation-Max |
0.25 W
|
0.25 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
IEC-60134
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
TO-236
|
Pin Count |
|
3
|
Manufacturer Package Code |
|
SOT23
|
JEDEC-95 Code |
|
TO-236AB
|
Operating Temperature-Max |
|
150 °C
|
Reverse Test Voltage |
|
4 V
|
|
|
|
Compare 933526230215 with alternatives
Compare BAS17,215 with alternatives