933835860005 vs CD74HCT377M96G4 feature comparison

933835860005 NXP Semiconductors

Buy Now Datasheet

CD74HCT377M96G4 Texas Instruments

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code DIE SOIC
Package Description DIE, SOP, SOP20,.4
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-XUUC-N R-PDSO-G20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Propagation Delay (tpd) 48 ns 57 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 18 MHz 16 MHz
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Pin Count 20
Additional Feature WITH HOLD MODE
JESD-609 Code e4
Length 12.8 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 16000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Terminals 20
Package Equivalence Code SOP20,.4
Packing Method TR
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.65 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm

Compare 933835860005 with alternatives

Compare CD74HCT377M96G4 with alternatives