934055282115
vs
1SS390
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
End Of Life
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROHM CO LTD
|
Part Package Code |
SC-79
|
SC-79
|
Package Description |
ULTRA SMALL, PLASTIC, SMD, UFP, SC-79, 2 PIN
|
R-PDSO-F2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.60
|
8541.10.00.60
|
Configuration |
SINGLE
|
SINGLE
|
Diode Capacitance-Max |
1.05 pF
|
1.2 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
MIXER DIODE
|
MIXER DIODE
|
Frequency Band |
VERY HIGH FREQUENCY
|
VERY HIGH FREQUENCY
|
JESD-30 Code |
R-PDSO-F2
|
R-PDSO-F2
|
JESD-609 Code |
e3
|
e1
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
125 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Power Dissipation-Max |
0.715 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
PLANAR DOPED BARRIER
|
|
Terminal Finish |
TIN
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
10
|
Base Number Matches |
1
|
6
|
Additional Feature |
|
HIGH RELIABILITY
|
Forward Voltage-Max (VF) |
|
1 V
|
Rep Pk Reverse Voltage-Max |
|
35 V
|
|
|
|
Compare 934055282115 with alternatives
Compare 1SS390 with alternatives