93C56AX-E/PG vs 93C56AXT-E/MSG feature comparison

93C56AX-E/PG Microchip Technology Inc

Buy Now Datasheet

93C56AXT-E/MSG Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP TSSOP
Package Description DIP, TSSOP,
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 3 MHz 3 MHz
JESD-30 Code R-PDIP-T8 S-PDSO-G8
JESD-609 Code e3 e3
Length 9.46 mm 3 mm
Memory Density 2048 bit 2048 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X8 256X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm 1.1 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Current-Max 0.002 mA 0.002 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Matte Tin (Sn) MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 3 mm
Write Cycle Time-Max (tWC) 2 ms 2 ms
Base Number Matches 1 1
Moisture Sensitivity Level 1

Compare 93C56AX-E/PG with alternatives

Compare 93C56AXT-E/MSG with alternatives