93C56BXT-I/OTG vs 93C56BT-I/P feature comparison

93C56BXT-I/OTG Microchip Technology Inc

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93C56BT-I/P Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code SOT-23 DIP
Package Description LSSOP, DIP,
Pin Count 6 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 3 MHz 3 MHz
JESD-30 Code R-PDSO-G6 R-PDIP-T8
JESD-609 Code e3 e3
Length 2.95 mm 9.46 mm
Memory Density 2048 bit 2048 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 6 8
Number of Words 128 words 128 words
Number of Words Code 128 128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128X16 128X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.45 mm 4.32 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Current-Max 0.002 mA 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 1.8 V
Supply Voltage-Nom (Vsup) 5 V 2.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.95 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 1.63 mm 7.62 mm
Write Cycle Time-Max (tWC) 2 ms 2 ms
Base Number Matches 1 1
Alternate Memory Width 8

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