93C66CX-E/ST vs 93C66C-E/MNY feature comparison

93C66CX-E/ST Microchip Technology Inc

Buy Now Datasheet

93C66C-E/MNY Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code SOIC DFN
Package Description TSSOP, HVSON,
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature ALSO CONFIGURABLE AS 512 X 8
Alternate Memory Width 8 8
Clock Frequency-Max (fCLK) 2 MHz 3 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-N8
JESD-609 Code e3 e4
Length 4.4 mm 3 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X16 256X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 0.8 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Current-Max 0.002 mA 0.002 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Width 3 mm 2 mm
Write Cycle Time-Max (tWC) 2 ms 2 ms
Base Number Matches 1 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 93C66C-E/MNY with alternatives