93LC66B-I/PREL vs 93LC66B-I/MNY feature comparison

93LC66B-I/PREL Microchip Technology Inc

Buy Now Datasheet

93LC66B-I/MNY Microchip Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP DFN
Package Description DIP, HVSON,
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
Clock Frequency-Max (fCLK) 1 MHz 2 MHz
Data Retention Time-Min 200
JESD-30 Code R-PDIP-T8 R-PDSO-N8
JESD-609 Code e3 e4
Length 9.27 mm 3 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256X16 256X16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP HVSON
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 5.33 mm 0.8 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Current-Max 0.002 mA 0.002 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 2.5 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position DUAL DUAL
Width 7.62 mm 2 mm
Write Cycle Time-Max (tWC) 6 ms 6 ms
Base Number Matches 1 1

Compare 93LC66B-I/PREL with alternatives

Compare 93LC66B-I/MNY with alternatives