93LC66BT-I/P vs 93LC66BT/ST102 feature comparison

93LC66BT-I/P Microchip Technology Inc

Buy Now Datasheet

93LC66BT/ST102 Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP SOIC
Package Description DIP, TSSOP,
Pin Count 8 8
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Alternate Memory Width 8
Clock Frequency-Max (fCLK) 2 MHz 2 MHz
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e3 e3
Length 9.46 mm 4.4 mm
Memory Density 1024 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 128 words 256 words
Number of Words Code 128 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128X8 256X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm 1.1 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Current-Max 0.003 mA 0.0015 mA
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 1.8 V 2.5 V
Supply Voltage-Nom (Vsup) 2.5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3 mm
Write Cycle Time-Max (tWC) 6 ms 6 ms
Base Number Matches 1 1
Additional Feature 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS
Data Retention Time-Min 200
Moisture Sensitivity Level 1

Compare 93LC66BT-I/P with alternatives

Compare 93LC66BT/ST102 with alternatives