93LC66BT-I/P vs 93LC66BXT-E/OTG feature comparison

93LC66BT-I/P Microchip Technology Inc

Buy Now Datasheet

93LC66BXT-E/OTG Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP SOT-23
Package Description DIP, LSSOP,
Pin Count 8 6
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Alternate Memory Width 8
Clock Frequency-Max (fCLK) 2 MHz 2 MHz
JESD-30 Code R-PDIP-T8 R-PDSO-G6
JESD-609 Code e3 e3
Length 9.46 mm 2.95 mm
Memory Density 1024 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 8 6
Number of Words 128 words 256 words
Number of Words Code 128 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128X8 256X16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 4.32 mm 1.45 mm
Serial Bus Type MICROWIRE MICROWIRE
Supply Current-Max 0.003 mA 0.002 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 2.5 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN Matte Tin (Sn)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.95 mm
Terminal Position DUAL DUAL
Width 7.62 mm 1.63 mm
Write Cycle Time-Max (tWC) 6 ms 6 ms
Base Number Matches 1 1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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Compare 93LC66BXT-E/OTG with alternatives