93LCS66-I/P
vs
M24C04-DW1T
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
STMICROELECTRONICS
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP8,.3
|
0.169 INCH, TSSOP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS
|
|
| Clock Frequency-Max (fCLK) |
2 MHz
|
0.4 MHz
|
| Data Retention Time-Min |
200
|
40
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
9.46 mm
|
4.4 mm
|
| Memory Density |
4096 bit
|
4096 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
16
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
256 words
|
512 words
|
| Number of Words Code |
256
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256X16
|
512X8
|
| Output Characteristics |
3-STATE
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP8,.3
|
TSSOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power Supplies |
3/5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.32 mm
|
1.2 mm
|
| Serial Bus Type |
MICROWIRE
|
I2C
|
| Standby Current-Max |
0.00003 A
|
0.000001 A
|
| Supply Current-Max |
0.003 mA
|
0.002 mA
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
3 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
5 ms
|
| Write Protection |
HARDWARE/SOFTWARE
|
HARDWARE
|
| Base Number Matches |
1
|
1
|
| I2C Control Byte |
|
1010DDMR
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare 93LCS66-I/P with alternatives
Compare M24C04-DW1T with alternatives