AD5381BST-3
vs
AD5381BST-3-REEL
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
14 X 14 MM, MS-026-BED, LQFP-100
|
14 X 14 MM, MS-026-BED, LQFP-100
|
Pin Count |
100
|
100
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
3.6 V
|
3.6 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
JESD-609 Code |
e0
|
e0
|
Length |
14 mm
|
14 mm
|
Linearity Error-Max (EL) |
0.0244%
|
0.0244%
|
Moisture Sensitivity Level |
3
|
3
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Equivalence Code |
QFP100,.63SQ,20
|
QFP100,.63SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
240
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Settling Time-Max |
8 µs
|
8 µs
|
Settling Time-Nom (tstl) |
6 µs
|
6 µs
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
2
|
1
|
|
|
|