AD558KP
vs
AD558JPZ-REEL
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QLCC
|
QLCC
|
| Package Description |
QCCJ,
|
QCCJ, LDCC20,.4SQ
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
compliant
|
| Analog Output Voltage-Max |
2.56 V
|
10 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
COMPLEMENTARY OFFSET BINARY
|
BINARY
|
| Input Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
| JESD-609 Code |
e0
|
e3
|
| Length |
8.966 mm
|
8.93 mm
|
| Linearity Error-Max (EL) |
0.0977%
|
0.1953%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
225
|
260
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.39 mm
|
| Settling Time-Nom (tstl) |
0.8 µs
|
2 µs
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
8.966 mm
|
8.93 mm
|
| Base Number Matches |
2
|
1
|
| Manufacturer Package Code |
|
P-20
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
LDCC20,.4SQ
|
| Settling Time-Max |
|
3 µs
|
| Supply Current-Max |
|
25 mA
|
|
|
|
Compare AD558JPZ-REEL with alternatives