AD670SD
vs
AD7655ACPRL
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
DIP
|
QFN
|
| Package Description |
DIP,
|
7 X 7 MM, MO-220-VKKD-2, LFCSP-48
|
| Pin Count |
20
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog Input Voltage-Max |
1.27 V
|
5 V
|
| Analog Input Voltage-Min |
-1.28 V
|
|
| Conversion Time-Max |
10 µs
|
1.25 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-CDIP-T20
|
S-XQCC-N48
|
| JESD-609 Code |
e0
|
e0
|
| Linearity Error-Max (EL) |
0.39%
|
0.0092%
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Analog In Channels |
2
|
4
|
| Number of Bits |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
48
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
SERIAL, PARALLEL, 8 BITS, PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
| Package Code |
DIP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
7 mm
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
7 mm
|
| Package Equivalence Code |
|
LCC48,.27SQ,20
|
| Sample Rate |
|
1 MHz
|
| Sample and Hold / Track and Hold |
|
SAMPLE
|
|
|
|
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