AD674BTE/883B
vs
MX574ALEPI+
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
QFN
|
DIP
|
| Package Description |
QCCN,
|
DIP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
compliant
|
| Analog Input Voltage-Max |
10 V
|
10 V
|
| Analog Input Voltage-Min |
-10 V
|
-10 V
|
| Conversion Time-Max |
15 µs
|
25 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
S-CQCC-N28
|
R-PDIP-T28
|
| Length |
11.43 mm
|
36.83 mm
|
| Linearity Error-Max (EL) |
0.0244%
|
0.0122%
|
| Moisture Sensitivity Level |
NOT APPLICABLE
|
1
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
260
|
| Seated Height-Max |
2.54 mm
|
5.08 mm
|
| Supply Voltage-Nom |
5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIMOS
|
BICMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
NOT SPECIFIED
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
30
|
| Width |
11.43 mm
|
15.24 mm
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e3
|
| Negative Supply Voltage-Nom |
|
-15 V
|
| Qualification Status |
|
Not Qualified
|
| Sample and Hold / Track and Hold |
|
SAMPLE
|
|
|
|
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