AD7543KP
vs
MX7534JP+T
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QLCC
|
QLCC
|
Package Description |
QCCJ,
|
QCCJ, LDCC20,.4SQ
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
compliant
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY, OFFSET BINARY
|
Input Format |
SERIAL
|
PARALLEL, 8 BITS
|
JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
JESD-609 Code |
e0
|
e3
|
Length |
8.9662 mm
|
8.9662 mm
|
Linearity Error-Max (EL) |
0.012%
|
0.0122%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
12
|
14
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
225
|
|
Qualification Status |
COMMERCIAL
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Nom |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
8.9662 mm
|
8.9662 mm
|
Base Number Matches |
2
|
1
|
HTS Code |
|
8542.39.00.01
|
Analog Output Voltage-Max |
|
10 V
|
Analog Output Voltage-Min |
|
-10 V
|
Package Equivalence Code |
|
LDCC20,.4SQ
|
Settling Time-Max |
|
1.5 µs
|
Settling Time-Nom (tstl) |
|
0.8 µs
|
Supply Current-Max |
|
3 mA
|
|
|
|
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