AD7809BST
vs
AD7809BSTZ
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
TQFP,
|
TQFP,
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Input Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G44
|
| JESD-609 Code |
e0
|
e3
|
| Length |
10 mm
|
10 mm
|
| Linearity Error-Max (EL) |
0.293%
|
0.293%
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TQFP
|
TQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE
|
FLATPACK, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Settling Time-Nom (tstl) |
1.5 µs
|
1.5 µs
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
4
|
2
|
|
|
|