AD7858BNZ
vs
ADC128S052CIMTX/NOPB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
TSSOP-16
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Analog Input Voltage-Max |
5.5 V
|
5.25 V
|
| Analog Input Voltage-Min |
|
|
| Conversion Time-Max |
4.6 µs
|
4.0625 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-PDIP-T24
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
31.165 mm
|
5 mm
|
| Linearity Error-Max (EL) |
0.0244%
|
0.0244%
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Number of Analog In Channels |
8
|
8
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
16
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
SERIAL
|
SERIAL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Sample Rate |
0.2 MHz
|
0.5 MHz
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
TSSOP16,.25
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.1 mm
|
|
|
|
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