AD7891AS-2
vs
AD7891AP-2REEL
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFP
|
LPCC
|
| Package Description |
QFP,
|
QCCJ,
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog Input Voltage-Max |
2.5 V
|
2.5 V
|
| Analog Input Voltage-Min |
-2.5 V
|
-2.5 V
|
| Conversion Time-Max |
1.6 µs
|
1.6 µs
|
| Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
| JESD-30 Code |
S-PQFP-G44
|
S-PQCC-J44
|
| JESD-609 Code |
e0
|
e0
|
| Length |
10 mm
|
16.585 mm
|
| Linearity Error-Max (EL) |
0.0244%
|
0.0244%
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Analog In Channels |
8
|
8
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY, 2'S COMPLEMENT BINARY
|
| Output Format |
SERIAL, PARALLEL, WORD
|
SERIAL, PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
240
|
225
|
| Sample Rate |
0.5 MHz
|
0.5 MHz
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Seated Height-Max |
2.45 mm
|
4.57 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.8 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
10 mm
|
16.585 mm
|
| Base Number Matches |
2
|
2
|
|
|
|