AD7952BCPZ
vs
AD7952BSTZRL
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFN
|
QFP
|
| Package Description |
HVQCCN,
|
LFQFP,
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog Input Voltage-Max |
5 V
|
5 V
|
| Analog Input Voltage-Min |
-5 V
|
-5 V
|
| Conversion Time-Max |
1.35 µs
|
1.35 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
S-XQCC-N48
|
S-PQFP-G48
|
| JESD-609 Code |
e3
|
e3
|
| Length |
7 mm
|
7 mm
|
| Linearity Error-Max (EL) |
0.0061%
|
0.0061%
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
14
|
14
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY, 2'S COMPLEMENT BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Sample Rate |
1 MHz
|
1 MHz
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Seated Height-Max |
1 mm
|
1.6 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
2
|
2
|
|
|
|