ADC081S101CISDX
vs
ADC081S051CISD/NOPB
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
HVSON, SOLCC6,.1,25
|
|
| Pin Count |
6
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Analog Input Voltage-Max |
5.25 V
|
5 V
|
| Analog Input Voltage-Min |
|
|
| Conversion Time-Max |
1 µs
|
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
A/D CONVERTER
|
| JESD-30 Code |
R-PDSO-N6
|
R-PDSO-N6
|
| JESD-609 Code |
e0
|
e3
|
| Length |
2.5 mm
|
|
| Linearity Error-Max (EL) |
0.1172%
|
0.12%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
SERIAL
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
SON
|
| Package Equivalence Code |
SOLCC6,.1,25
|
SOLCC6,.1,25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
1 MHz
|
|
| Sample and Hold / Track and Hold |
TRACK
|
|
| Seated Height-Max |
0.8 mm
|
|
| Supply Voltage-Nom |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
2.2 mm
|
|
| Base Number Matches |
2
|
2
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare ADC081S101CISDX with alternatives