ADC10030CIVT/NOPB
vs
ADC10030CIVTX
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
TQFP-32
|
TQFP-32
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Analog Input Voltage-Max |
3.8 V
|
3.8 V
|
| Analog Input Voltage-Min |
1.6 V
|
1.6 V
|
| Converter Type |
ADC, RESISTANCE LADDER
|
ADC, RESISTANCE LADDER
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| JESD-609 Code |
e3
|
e0
|
| Length |
7 mm
|
7 mm
|
| Linearity Error-Max (EL) |
0.0977%
|
0.0977%
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
LQFP
|
| Package Equivalence Code |
QFP32,.35SQ,32
|
QFP32,.35SQ,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
235
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
30 MHz
|
30 MHz
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
7 mm
|
7 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ADC10030CIVT/NOPB with alternatives
Compare ADC10030CIVTX with alternatives