ADC1006S070H/C1,55
vs
ADC1006S070H
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
QFP
|
|
Package Description |
10 X 10 MM, 1.75 MM HEIGHT, PLASTIC, SOT-307-2, QFP-44
|
QFP, QFP44,.40SQ,32
|
Pin Count |
44
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
2 V
|
2 V
|
Analog Input Voltage-Min |
1 V
|
-2 V
|
Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
JESD-30 Code |
S-PQFP-G44
|
S-PQFP-G44
|
JESD-609 Code |
e3
|
|
Length |
10 mm
|
10 mm
|
Linearity Error-Max (EL) |
0.1094%
|
0.109375%
|
Moisture Sensitivity Level |
3
|
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
10
|
10
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
BINARY, 2'S COMPLEMENT BINARY
|
BINARY, 2'S COMPLEMENT BINARY
|
Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
QFP44,.5SQ,32
|
QFP44,.40SQ,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
|
Sample Rate |
70 MHz
|
70 MHz
|
Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
Seated Height-Max |
2.1 mm
|
2.1 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
1
|
3
|
Supply Current-Max |
|
87 mA
|
|
|
|