ADC1173CIMTC/NOPB
vs
ADC1173CIMTC
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
TSSOP, TSSOP24,.25
|
TSSOP-24
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
1.56 V
|
1.56 V
|
Analog Input Voltage-Min |
0.36 V
|
0.36 V
|
Converter Type |
ADC, RESISTANCE LADDER
|
ADC, RESISTANCE LADDER
|
JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
JESD-609 Code |
e3
|
e0
|
Length |
7.8 mm
|
7.8 mm
|
Linearity Error-Max (EL) |
0.5078%
|
0.5078%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
BINARY
|
BINARY
|
Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP24,.25
|
TSSOP24,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
15 MHz
|
15 MHz
|
Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
1
|
4
|
|
|
|