ADC12D1000RFIUT/NOPB
vs
ADC12D1000RFIUT
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
LEAD FREE, PLASTIC, MS-034BAL-2, BGA-292
|
HBGA, BGA292,20X20,50
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.5.A.3
|
3A001.A.5.A.3
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
0.86 V
|
0.86 V
|
| Analog Input Voltage-Min |
-0.86 V
|
-0.86 V
|
| Converter Type |
ADC, PROPRIETARY METHOD
|
ADC, PROPRIETARY METHOD
|
| JESD-30 Code |
S-PBGA-B292
|
S-PBGA-B292
|
| Length |
27 mm
|
27 mm
|
| Linearity Error-Max (EL) |
0.177%
|
0.177%
|
| Number of Analog In Channels |
2
|
2
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
292
|
292
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
|
BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HBGA
|
HBGA
|
| Package Equivalence Code |
BGA292,20X20,50
|
BGA292,20X20,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, HEAT SINK/SLUG
|
GRID ARRAY, HEAT SINK/SLUG
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
1000 MHz
|
1000 MHz
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Seated Height-Max |
2.58 mm
|
2.58 mm
|
| Supply Voltage-Nom |
1.9 V
|
1.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
1
|
2
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare ADC12D1000RFIUT/NOPB with alternatives
Compare ADC12D1000RFIUT with alternatives