ADG819BCBZ-REEL vs ADG819BCB-REEL7 feature comparison

ADG819BCBZ-REEL Analog Devices Inc

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ADG819BCB-REEL7 Analog Devices Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ANALOG DEVICES INC ANALOG DEVICES INC
Part Package Code BGA BGA
Package Description VFBGA, BGA6,2X3,20 VFBGA, BGA6,2X3,20
Pin Count 6 6
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPDT SPDT
JESD-30 Code R-XBGA-B6 R-XBGA-B6
JESD-609 Code e1 e0
Length 2.18 mm 2.18 mm
Moisture Sensitivity Level 1 1
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 6 6
Off-state Isolation-Nom 71 dB 71 dB
On-state Resistance Match-Nom 0.06 Ω 0.06 Ω
On-state Resistance-Max (Ron) 1.4 Ω 1.4 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code VFBGA VFBGA
Package Equivalence Code BGA6,2X3,20 BGA6,2X3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.67 mm 0.67 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Switch-off Time-Max 16 ns 16 ns
Switch-on Time-Max 60 ns 60 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Width 1.14 mm 1.14 mm
Base Number Matches 1 1

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