ADSP-BF506BSWZ-3F
vs
ADSP-BF504BCPZ-4F
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFP
|
QFN
|
| Package Description |
HLFQFP,
|
12 X 12 MM, ROHS COMPLIANT, LFCSP_VQ-88
|
| Pin Count |
120
|
88
|
| Reach Compliance Code |
unknown
|
unknown
|
| Address Bus Width |
|
|
| Barrel Shifter |
YES
|
YES
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
50 MHz
|
50 MHz
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PQFP-G120
|
S-XQCC-N88
|
| Length |
14 mm
|
12 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
120
|
88
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
HLFQFP
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
1.6 mm
|
0.85 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
Yes
|
| Manufacturer Package Code |
|
CP-88-5
|
| ECCN Code |
|
3A991.A.2
|
| HTS Code |
|
8542.31.00.01
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Bit Size |
|
32
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
LCC88,.47SQ,20
|
| Qualification Status |
|
Not Qualified
|
| Speed |
|
400 MHz
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
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