ADSP-BF533SKBC750X vs ADSP-BF532SBB400 feature comparison

ADSP-BF533SKBC750X Analog Devices Inc

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ADSP-BF532SBB400 Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ANALOG DEVICES INC ROCHESTER ELECTRONICS INC
Part Package Code BGA BGA
Package Description LFBGA, BGA160,14X14,32 BGA,
Pin Count 160 169
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature ALSO REQUIRES 3V OR 3.3V SUPPLY ALSO REQUIRES 3V OR 3.3V SUPPLY
Address Bus Width 20 20
Barrel Shifter YES YES
Bit Size 32
Boundary Scan YES YES
Clock Frequency-Max 40 MHz 40 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B160 S-PBGA-B169
JESD-609 Code e0 e0
Length 12 mm 19 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 160 169
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA BGA
Package Equivalence Code BGA160,14X14,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.7 mm 2.5 mm
Speed 756 MHz
Supply Voltage-Max 1.32 V 1.32 V
Supply Voltage-Min 0.8 V 0.8 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD SILVER TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 12 mm 19 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 2
Pbfree Code No
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30

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Compare ADSP-BF532SBB400 with alternatives