AM186ER-25KC/W
vs
AM186EDLV-25KCW
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
QFP-100
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Has ADC |
NO
|
|
| Address Bus Width |
20
|
|
| Bit Size |
16
|
|
| Boundary Scan |
NO
|
|
| CPU Family |
AM80C186
|
|
| Clock Frequency-Max |
12.5 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
16
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
R-PQFP-G100
|
|
| JESD-609 Code |
e0
|
|
| Length |
20 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of DMA Channels |
2
|
|
| Number of External Interrupts |
6
|
|
| Number of I/O Lines |
32
|
|
| Number of Serial I/Os |
1
|
|
| Number of Terminals |
100
|
|
| Number of Timers |
3
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
|
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
|
|
| PWM Channels |
NO
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QFP
|
|
| Package Equivalence Code |
QFP100,.7X.9
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLATPACK
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
32768
|
|
| ROM (words) |
0
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
3.35 mm
|
|
| Speed |
25 MHz
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
3.3 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
14 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
1
|
| HTS Code |
|
8542.31.00.01
|
|
|
|
Compare AM186ER-25KC/W with alternatives
Compare AM186EDLV-25KCW with alternatives