AM2148-35LCB
vs
MBM10470A-15CZ
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
Part Package Code |
LCC
|
DIP
|
Package Description |
QCCN, LCC18,.3X.35
|
DIP,
|
Pin Count |
18
|
18
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
35 ns
|
15 ns
|
Additional Feature |
AUTOMATIC POWER-DOWN
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-CQCC-N18
|
R-GDIP-T18
|
JESD-609 Code |
e0
|
|
Memory Density |
4096 bit
|
4096 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
18
|
18
|
Number of Words |
1024 words
|
4096 words
|
Number of Words Code |
1000
|
4000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Organization |
1KX4
|
4KX1
|
Output Characteristics |
3-STATE
|
OPEN-EMITTER
|
Output Enable |
NO
|
NO
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCN
|
DIP
|
Package Equivalence Code |
LCC18,.3X.35
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.54 mm
|
5.08 mm
|
Supply Current-Max |
0.18 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
NO
|
Technology |
NMOS
|
TTL
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
7.4295 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Length |
|
22.78 mm
|
|
|
|
Compare AM2148-35LCB with alternatives
Compare MBM10470A-15CZ with alternatives