Part Details for MBM10470A-15CZ by FUJITSU Limited
Overview of MBM10470A-15CZ by FUJITSU Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for MBM10470A-15CZ
MBM10470A-15CZ CAD Models
MBM10470A-15CZ Part Data Attributes:
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MBM10470A-15CZ
FUJITSU Limited
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Datasheet
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MBM10470A-15CZ
FUJITSU Limited
4KX1 STANDARD SRAM, 15ns, CDIP18, CERDIP-18
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FUJITSU SEMICONDUCTOR AMERICA INC | |
Part Package Code | DIP | |
Package Description | DIP, | |
Pin Count | 18 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 15 ns | |
JESD-30 Code | R-GDIP-T18 | |
Length | 22.78 mm | |
Memory Density | 4096 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 1 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 18 | |
Number of Words | 4096 words | |
Number of Words Code | 4000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 75 °C | |
Operating Temperature-Min | ||
Organization | 4KX1 | |
Output Characteristics | OPEN-EMITTER | |
Output Enable | NO | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | DIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.08 mm | |
Surface Mount | NO | |
Technology | TTL | |
Temperature Grade | COMMERCIAL EXTENDED | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for MBM10470A-15CZ
This table gives cross-reference parts and alternative options found for MBM10470A-15CZ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBM10470A-15CZ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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IDT6167LA25SO8 | Standard SRAM, 16KX1, 25ns, CMOS, PDSO20, 0.300 INCH, SOIC-20 | Integrated Device Technology Inc | MBM10470A-15CZ vs IDT6167LA25SO8 |
L7C167DME15 | Standard SRAM, 16KX1, 15ns, CMOS, CDIP20, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-20 | LOGIC Devices Inc | MBM10470A-15CZ vs L7C167DME15 |
IDT6167SA45DB | Standard SRAM, 16KX1, 45ns, CMOS, CDIP20, 0.300 INCH, CERDIP-20 | Integrated Device Technology Inc | MBM10470A-15CZ vs IDT6167SA45DB |
HM4-65262-2:R | Standard SRAM, 16KX1, 85ns, CMOS, CQCC20 | Matra MHS | MBM10470A-15CZ vs HM4-65262-2:R |
MBM10470A-10CZ | Standard SRAM, 4KX1, 10ns, TTL, CDIP18, CERDIP-18 | FUJITSU Semiconductor Limited | MBM10470A-15CZ vs MBM10470A-10CZ |
QD2148H-2 | Standard SRAM, 1KX4, 45ns, NMOS, CDIP18, CERDIP-18 | Intel Corporation | MBM10470A-15CZ vs QD2148H-2 |
CY7C167-25VC | Standard SRAM, 16KX1, 25ns, CMOS, PDSO20, PLASTIC, SOJ-20 | Cypress Semiconductor | MBM10470A-15CZ vs CY7C167-25VC |
MBM10470A-20CV | 4KX1 STANDARD SRAM, 20ns, CQCC18, FRIT SEALED, CERAMIC, LCC-18 | FUJITSU Limited | MBM10470A-15CZ vs MBM10470A-20CV |
HM4-65262C-6:RD | Standard SRAM, 16KX1, CMOS, CQCC20 | Matra MHS | MBM10470A-15CZ vs HM4-65262C-6:RD |
CY21L48-45PC | Standard SRAM, 1KX4, 45ns, CMOS, PDIP18, PLASTIC, DIP-18 | Cypress Semiconductor | MBM10470A-15CZ vs CY21L48-45PC |