AM27C1024-150JC
vs
HN27C1024HCP-15
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SPANSION INC
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
LCC
|
LCC
|
| Package Description |
QCCJ,
|
QCCJ,
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
90 ns
|
150 ns
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
| Length |
16.586 mm
|
16.58 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Number of Words |
65536 words
|
65536 words
|
| Number of Words Code |
128000
|
64000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
128KX8
|
64KX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
4.6 mm
|
| Supply Current-Max |
0.05 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
16.586 mm
|
16.58 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare AM27C1024-150JC with alternatives
Compare HN27C1024HCP-15 with alternatives