AM27C512-150JI
vs
TMS27PC512-15FML4
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
TEXAS INSTRUMENTS INC
Part Package Code
QFJ
Package Description
PLASTIC, LCC-32
QCCJ, LDCC32,.5X.6
Pin Count
32
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
150 ns
150 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e0
Length
13.97 mm
13.97 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64KX8
64KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC32,.5X.6
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.55 mm
3.56 mm
Standby Current-Max
0.0001 A
0.00025 A
Supply Current-Max
0.025 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.43 mm
Base Number Matches
1
1
Pbfree Code
No
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare AM27C512-150JI with alternatives
Compare TMS27PC512-15FML4 with alternatives