AM27C64-150DCB
vs
CY7C265-15LC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP, DIP28,.6
|
QCCN, LCC28,.45SQ
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.61
|
8542.32.00.71
|
| Access Time-Max |
150 ns
|
12 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-CDIP-T28
|
S-CQCC-N28
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
UVPROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8KX8
|
8KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP28,.6
|
LCC28,.45SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
12.75 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.0001 A
|
0.12 A
|
| Supply Current-Max |
0.025 mA
|
0.12 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
No
|
|
|
|
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