AM27S25ADCB
vs
5962-88518013X
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP, DIP24,.3
|
QCCN,
|
| Pin Count |
24
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
200 ns
|
15 ns
|
| JESD-30 Code |
R-GDIP-T24
|
S-XQCC-N28
|
| JESD-609 Code |
e0
|
|
| Length |
31.9405 mm
|
|
| Memory Density |
262144 bit
|
4096 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
28
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
32000
|
512
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
32KX8
|
512X8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP24,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare AM27S25ADCB with alternatives
Compare 5962-88518013X with alternatives