AM2964BXC
vs
AM2964BDM
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
DIE
|
DIP
|
| Package Description |
DIE, DIE OR CHIP
|
DIP, DIP40,.6
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
16
|
16
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-XUUC-N40
|
R-CDIP-T40
|
| Low Power Mode |
NO
|
NO
|
| Memory Organization |
176K X 8
|
176K X 8
|
| Number of Banks |
4
|
4
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIE
|
DIP
|
| Package Equivalence Code |
DIE OR CHIP
|
DIP40,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
173 mA
|
164 mA
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MEMORY CONTROLLER, DRAM
|
MEMORY CONTROLLER, DRAM
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| ECCN Code |
|
3A001.A.2.C
|
| JESD-609 Code |
|
e0
|
| Length |
|
52.324 mm
|
| Screening Level |
|
MIL-STD-883 Class C
|
| Seated Height-Max |
|
5.715 mm
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
15.24 mm
|
|
|
|
Compare AM2964BXC with alternatives
Compare AM2964BDM with alternatives