AM29DL640H55WHF vs AM29LV640GU53RWHI feature comparison

AM29DL640H55WHF Spansion

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AM29LV640GU53RWHI Cypress Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description 12 X 11 MM, 0.80 MM PITCH, FBGA-63
Pin Count 63
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 55 ns 55 ns
Alternate Memory Width 8
Boot Block BOTTOM/TOP
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e1
Length 12 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 63 63
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA FBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 11 mm
Base Number Matches 1 3
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 128
Package Equivalence Code BGA63,8X12,32
Power Supplies 3.3 V
Ready/Busy YES
Sector Size 32K
Standby Current-Max 0.000005 A
Supply Current-Max 0.026 mA
Toggle Bit YES

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