AM29DL800BB70REC vs AM29LV800BT70EI feature comparison

AM29DL800BB70REC Spansion

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AM29LV800BT70EI Spansion

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code TSOP TSOP1
Package Description TSOP-48 TSOP1,
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns 70 ns
Alternate Memory Width 8 8
Boot Block BOTTOM
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e0
Length 18.4 mm 18.4 mm
Memory Density 8388608 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 1048576 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 12 mm 12 mm
Base Number Matches 2 2
Additional Feature CONFG AS 512K X 16; TOP BOOT BLOCK
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30

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