AM29F010B-120DGC1 vs W29EE011-12 feature comparison

AM29F010B-120DGC1 Spansion

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W29EE011-12 Winbond Electronics Corp

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC WINBOND ELECTRONICS CORP
Part Package Code DIE DIP
Package Description DIE-30 0.600 INCH, PLASTIC, DIP-32
Pin Count 30 32
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 120 ns
JESD-30 Code R-XUUC-N30 R-PDIP-T32
JESD-609 Code e0 e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 30 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX8 128KX8
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Type NOR TYPE NOR TYPE
Base Number Matches 1 2
Command User Interface NO
Data Polling YES
Length 41.91 mm
Number of Sectors/Size 1K
Package Equivalence Code DIP32,.6
Seated Height-Max 5.33 mm
Sector Size 128
Standby Current-Max 0.0001 A
Supply Current-Max 0.05 mA
Terminal Pitch 2.54 mm
Toggle Bit YES
Width 15.24 mm

Compare AM29F010B-120DGC1 with alternatives

Compare W29EE011-12 with alternatives