AM29F040-75DI vs AM29F040B-70ECB feature comparison

AM29F040-75DI AMD

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AM29F040B-70ECB Spansion

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code DIP TSOP
Package Description HERMETIC SEALED, CERAMIC, DIP-32 TSOP1,
Pin Count 32 32
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BULK ERASE; AUTOMATIC WRITE 1000K PROGRAM/ERASE CYCLES; DATA RETENTION 20 YEARS
JESD-30 Code R-GDIP-T32 R-PDSO-G32
Length 42.1005 mm 18.4 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX8 512KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 15.24 mm 8 mm
Base Number Matches 1 1
Rohs Code No
Data Retention Time-Min 20
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

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Compare AM29F040B-70ECB with alternatives