AM29F160DT90EE
vs
AM29F160DB55EC
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SENSITRON SEMICONDUCTOR
|
SPANSION INC
|
| Part Package Code |
TSOP1
|
TSOP
|
| Package Description |
MO-142(B)DD, PLASTIC, TSOP -48
|
SOP,
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
compliant
|
| Base Number Matches |
3
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Access Time-Max |
|
55 ns
|
| Additional Feature |
|
CONFG AS 1M X 16; 1000K WRITE CYCLES MIN; DATA RETENTION 20 YEARS; BOTTOM BOOT BLOCK
|
| Boot Block |
|
BOTTOM
|
| Data Retention Time-Min |
|
20
|
| JESD-30 Code |
|
R-PDSO-G48
|
| JESD-609 Code |
|
e0
|
| Memory Density |
|
16777216 bit
|
| Memory IC Type |
|
FLASH
|
| Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
48
|
| Number of Words |
|
2097152 words
|
| Number of Words Code |
|
2000000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
2MX8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Programming Voltage |
|
5 V
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
DUAL
|
| Type |
|
NOR TYPE
|
|
|
|
Compare AM29F160DT90EE with alternatives
Compare AM29F160DB55EC with alternatives