AM29F160DU70FI vs AM29LV160MT-70EF feature comparison

AM29F160DU70FI AMD

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AM29LV160MT-70EF Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code TSOP TSOP
Package Description REVERSE, TSOP-48 TSOP1,
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature MINIMUM 1000K WRITE CYCLE; CAN ALSO BE CONFIGURABLE AS 1M X 16
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 1048576 words
Number of Words Code 2000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Type NOR TYPE
Base Number Matches 1 2
Rohs Code Yes
Alternate Memory Width 8
JESD-609 Code e3
Length 18.4 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm
Terminal Finish MATTE TIN
Terminal Pitch 0.5 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 12 mm

Compare AM29F160DU70FI with alternatives

Compare AM29LV160MT-70EF with alternatives