AM29F160DU70FI vs M29W160DT70M1E feature comparison

AM29F160DU70FI AMD

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M29W160DT70M1E STMicroelectronics

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC STMICROELECTRONICS
Part Package Code TSOP SOIC
Package Description REVERSE, TSOP-48 0.525 INCH, PLASTIC, SO-44
Pin Count 48 44
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature MINIMUM 1000K WRITE CYCLE; CAN ALSO BE CONFIGURABLE AS 1M X 16 TOP BOOT BLOCK
JESD-30 Code R-PDSO-G48 R-PDSO-G44
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 16
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 2097152 words 1048576 words
Number of Words Code 2000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX8 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Base Number Matches 1 1
Rohs Code Yes
Alternate Memory Width 8
Boot Block TOP
Length 28.2 mm
Peak Reflow Temperature (Cel) 250
Seated Height-Max 2.8 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13.3 mm

Compare AM29F160DU70FI with alternatives

Compare M29W160DT70M1E with alternatives