AM29F200BB-70EIT
vs
M29F200FB55N6S2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SPANSION INC
|
MICRON TECHNOLOGY INC
|
| Part Package Code |
TSOP1
|
|
| Package Description |
MO-142DD, TSOP-48
|
,
|
| Pin Count |
48
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Access Time-Max |
70 ns
|
|
| Additional Feature |
BOTTOM BOOT BLOCK
|
|
| Alternate Memory Width |
8
|
|
| Boot Block |
BOTTOM
|
|
| JESD-30 Code |
R-PDSO-G48
|
|
| JESD-609 Code |
e0
|
|
| Length |
18.4 mm
|
|
| Memory Density |
2097152 bit
|
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
48
|
|
| Number of Words |
131072 words
|
|
| Number of Words Code |
128000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128KX16
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSOP1
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
DUAL
|
|
| Type |
NOR TYPE
|
|
| Width |
12 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare AM29F200BB-70EIT with alternatives
Compare M29F200FB55N6S2 with alternatives