AM29LV160BB80FC vs M29W160DT70M1E feature comparison

AM29LV160BB80FC Spansion

Buy Now Datasheet

M29W160DT70M1E STMicroelectronics

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC STMICROELECTRONICS
Part Package Code TSOP SOIC
Package Description TSOP1-R, 0.525 INCH, PLASTIC, SO-44
Pin Count 48 44
Reach Compliance Code compliant compliant
Access Time-Max 80 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK TOP BOOT BLOCK
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G48 R-PDSO-G44
JESD-609 Code e0
Length 18.4 mm 28.2 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1-R SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 250
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 12 mm 13.3 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block TOP
Type NOR TYPE

Compare AM29LV160BB80FC with alternatives

Compare M29W160DT70M1E with alternatives