AM29LV160DT70FE vs PH28F160B3BD70 feature comparison

AM29LV160DT70FE Spansion

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PH28F160B3BD70 Numonyx Memory Solutions

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC NUMONYX
Part Package Code TSOP BGA
Package Description TSOP1-R, LEAD FREE, VFBGA-48
Pin Count 48 48
Reach Compliance Code compliant unknown
Access Time-Max 70 ns 70 ns
Additional Feature EMBEDDED ALGORITHMS; 20 YEARS DATA RETENTION; TOP BOOT BLOCK BOTTOM BOOT BLOCK
Alternate Memory Width 8
JESD-30 Code R-PDSO-G48 R-PBGA-B48
JESD-609 Code e0
Length 18.4 mm 7.286 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1-R VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Programming Voltage 3 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.75 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 12 mm 6.964 mm
Base Number Matches 2 2
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block BOTTOM
Type NOR TYPE

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Compare PH28F160B3BD70 with alternatives