AM29LV400BB-55REI vs AM29LV400BT-55RFC feature comparison

AM29LV400BB-55REI Spansion

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AM29LV400BT-55RFC AMD

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code TSOP TSOP
Package Description TSOP1, TSOP1-R,
Pin Count 48 48
Reach Compliance Code compliant unknown
Access Time-Max 55 ns 55 ns
Additional Feature CONFG AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK CONFG AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION; TOP BOOT BLOCK
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0
Length 18.4 mm 18.4 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX8 512KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1-R
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm 12 mm
Base Number Matches 2 2

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Compare AM29LV400BT-55RFC with alternatives